Research and Markets has added the report titled "Gallium Nitride (GaN) Semiconductor Devices (Discretes & ICs) Market, Global Forecast & Analysis (2012 - 2022)" to its catalogue.
A research team comprising Drs. Takaaki Mano, Yoshiki Sakuma and Masafumi Jo from the Photonic Materials Unit of the National Institute for Materials Science is involved in the development of a sophisticated self-assembling technology known as droplet epitaxy for semiconductor quantum dots.
Applied Materials, a provider of innovative equipment, services and software to enable the production of advanced semiconductor, flat panel display and solar photovoltaic products, has introduced Applied UVision 5 wafer inspection system to monitor the defects in sub-20 nm critical patterning layers of logic devices.
STATS ChipPAC, a major provider of semiconductor packaging test, design, assembly and distribution solutions, has reported that its cutting-edge flip chip packaging technology called fcCuBE technology featuring improved assembly processes, bond-on-lead interconnection and copper column bumps is under large-scale production for numerous customers.
Tokyo Electron U.S.’ subsidiary, TEL NEXX has declared a new joint development program with IBM in 3D semiconductor packaging.
The universities of Kent, Bristol along with Huddersfield and Rutherford Appleton Laboratory researchers have found a new unusual series of unconventional superconductors.
STATS ChipPAC, headquartered in Singapore, has achieved a milestone with shipments exceeding one billion copper wirebond units. Major drivers that contributed to this achievement are the company’s well-established high volume manufacturing capabilities and the engineering focus on the development of copper wire technology for a wide range of advanced, leaded and multi-die laminate packages.
AKHAN Technologies and Argonne National Laboratory’s Center for Nanoscale Materials (CNM) have teamed up for the complete characterization of the innovative Miraj Diamond materials and devices.
Diversified manufacturing company, EDAC Technologies has purchased EBTEC, a company that provides sophisticated fabrication solutions and precision manufacturing processes to power generation, aerospace, medical, semiconductor and industrial customers. In 2011, EBTEC had $12.6 million sales.
An artificial leaf is developed by scientists from the Photovoltaic and Optoelectronic Devices group at the Universitat Jaume I using semiconductor materials. The technology has been named as artificial photosynthesis and it has the ability to produce hydrogen in water using merely sunlight.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.