STATS ChipPAC, headquartered in Singapore, has achieved a milestone with shipments exceeding one billion copper wirebond units. Major drivers that contributed to this achievement are the company’s well-established high volume manufacturing capabilities and the engineering focus on the development of copper wire technology for a wide range of advanced, leaded and multi-die laminate packages.
Copper wires offer stronger mechanical properties, enhanced electrical and thermal performance and better conductivity when compared to gold. There is a rising demand for copper wire application in more advanced packages, including three dimensional (3D) packaging, as the trend in the semiconductor industry is shifting towards thinner wire diameters, finer bond pad pitches and higher pin counts.
STATS ChipPAC is rapidly expanding its copper wire offerings with a variety of 3D pack configurations, a wide technology offering, and wire diameters down to 0.6 mm.
The major factor which encouraged the industry's shift to copper wire is cost reduction. STATS ChipPAC has also enhanced materials and processes, such as ultra high density substrates and Palladium (Pd) coated wires. Copper wire coated with Pd delivers a reliable, cost-effective interconnection with greater production yields as well as a process that will not break the weak bond pads in advanced devices. In terms of manufacturing process improvements, the company is attempting to develop copper wirebond interconnect on ultra high density strips for use in both laminate and leaded packages.
Source: http://www.statschippac.com/
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