EP29LPSP Epoxy System from Master Bond
This video shows EP29LPSP, two component, low viscosity, modified heat cured epoxy system from Master Bond. This epoxy system is used for bonding, sealing and coating formulated for service at cryogenic temperatures and capable of withstanding cryogenic shock. The EP29LPSP has superior electrical insulation properties and a good chemical resistance profile.
Run Time – 1:18min