Aug 23 2009
This two day seminar to be held on October 20-21 in San Jose, Californis is designed to educate engineers and technical personnel about both conventional and cutting-edge aspects of wafer bonding processes and their applicability to the fabrication of MEMS devices, which until recently had limited applications as well as batch compatible first order packaging processes. Wafer bonding has exploded into many new areas, including mainstream IC, III-V, optical devices and bonded substrates for sensors, micro-fluidic structures, 3D integration, LED's and solar cells.
The seminar covers wafer bonding processes and background theory, practical tips, equipment considerations and applications. Associated processes such as wafer preparation, metrology, and measurement of bond strength and interface voids are also included.
The seminar will be instructed by Tony Rogers, who is the co-founder and current technical director of Applied Microengineering Ltd. (AML). Tony is responsible for all wafer bonding and microengineering technology development for AML. His previous experience covered the design and development of field emission arrays and a wide variety of MEMS sensors and microstructures.
Information about this and technical seminars in other locations is available at www.SeminarsForEngineers.com, by emailing [email protected], or by phoning 1.877.755.2272.