NuSil Technology Introduces Non-Corrosive Silicone Adhesive for Electronics Applications

Manufacturer and supplier of silicone-based products for healthcare, photonics, electronics aerospace industries, NuSil Technology has launched a non-corrosive, thermally conductive silicone adhesive called EPM-2890 for the electronics industry.

The EPM-2890 offers controlled heat transfer between heat sinks and electrical parts. Moreover, it demonstrates ≤ 1% weight loss when heated at 275°C for 30 minutes to tolerate lead-free solder reflow.

The EPM-2890 is a single-part, white silicone adhesive that will vulcanize with moisture in 72 h at room temperature. The adhesive can be utilized as a potting or caulking material, sealing or adhesive in electronics applications, which demand least volatility to eliminate condensation in sensitive devices.

The EPM-2890 exhibits a least primer-less-adhesion of 100 psi on aluminum for applications where adhesion property is vital such as joining LCD displays to make them rugged. It offers improved thermal conductivity at 0.6 W/(mK) for uses that require stress relief in heat management and thermal cycling.

The EPM-2890 is suitable for applications involving channels or other patterns that need non-flow and non-slumping controlled-flow material. The silicone adhesive is available in a simple, single-part setup, which assures homogeneity and is convenient to use. The EPM-2890's extrusion rate is 40 g/min and thus it is suitable to be applied on small spaces that require a thin bond line.

Source: http://www.nusil.com

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