NuSil Technology, formulator of silicone compounds for application in various industries, has launched a silicone thermal interface material labeled EPM1-2493.
EPM1-2493 Electronic Adhesive material
The silicone elastomer is characterized by low modulus, low viscosity and a 1 W/mk thermal conductivity. In order to reduce stress at the time of thermal cycling, EPM1-2493 can be employed to hold together materials with varied coefficients of thermal expansion (CTE) with bonding lines as thin as 5 µ. The elastomer sticks well to aluminum and the adhesive strength can be enhanced by adding a primer that imparts lap shear values averaging at 120 psi (0.8 MPa). The low volatility of EPM1-2493 facilitates the reduction of contaminants in electronic components employed in high temperature applications.
In contrast to conventional paste-like thermally conductive silicones, EPM1-2493 is in the form of a pourable liquid making it suitable for filling recesses and in electronic circuits with intricate designs. It is ideal for sticking base plates, integrated circuit substrates and heat sinks. The EPM1-2493 can be cured at low temperatures. It can also be cured at higher temperatures to accelerate the curing process. The elastomer is available in a 1:1 mix ratio that can be filled into syringes to enable automated dispensing.
NuSil Technology formulates silicone compounds for aerospace, healthcare, electronics and other applications needing accurate, predictable materials performance. The company is ISO 9001-certified since 1994 and operates sophisticated processing centers and laboratories in North America. It offers application engineering support across the globe.
Source: http://www.nusil.com/