Tegal Received Another Order for ACS900 Series Etch System from Wireless Component Manufacturer

Tegal Corporation today announced that a leading wireless component supplier has placed a multiple system order for 901ACS diode plasma etch systems featuring the Advanced Control System.  The three new systems, valued at over $1 million, will expand this supplier’s existing production capacity in gallium arsenide (GaAs) semiconductors, which are widely used in wireless communications products. The last multiple system order from this customer occurred in July of 2004, and was based on the excellent performance of the Tegal 901 tools currently on-site, along with Tegal’s technical support and experience in etching specialty materials on non-standard substrates.

“The wireless industry is recovering and driving our sales across all product lines,” said Murali Narasimhan, Tegal’s Vice President of Marketing.  “We are committed to continuously improving our offerings to producers of wireless components, and to making our capabilities known to a larger group of potential customers.   We are very pleased to be rewarded with this repeat order from an important customer.”

The Tegal 901ACS is among the latest in a series of diode plasma etch systems produced by Tegal for companies around the world. Over 1,500 systems have been shipped and continue to provide reliable and cost-effective support for a wide range of processes.  The Tegal 900ACS series is intended for a wide variety of applications, including pad, zero layer, non-selective nitride, backside and planarization, as well as oxide, nitride, poly and compound materials applications, such as GaAs.  The platform incorporates a production-proven transport system that can accommodate 75 mm to 200 mm round, square or rectangular substrates.

The ACS upgrade is available exclusively from Tegal as a field or factory retrofit for the existing installed base of 900 and 980 series systems. It features a fully integrated graphical user interface, parametric data logging, full factory automation support, and throughput enhancements for the wafer-handling system. .

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