Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging challenges.
The BrewerBOND T1100 and BrewerBOND C1300 series combine to create Brewer Science’s first complete, dual-layer system for temporary bonding and debonding of product wafers. The new system was developed for power, memory and chip-first fan-out devices – all of which have stringent requirements with respect to temperature, power and performance. The system can be used with either mechanical or laser debonding methods.
The BrewerBUILD material was specifically created for redistribution-layer (RDL)-first fan-out wafer-level packaging (FOWLP). Developed to meet the needs of chipmakers looking to transition from chip-first FOWLP but not yet ready to tackle 2.5D/3D packaging, the single-layer material is compatible with both wafer- and panel-level temporary bonding/debonding processes.
“As industry requirements advance, Brewer Science continues to push forward the state of the art in our materials offerings,” said Kim Arnold, executive director, Advanced Packaging Business Unit, Brewer Science Inc. “Through close collaboration with our customers, we are driving the technology forward, leveraging our R&D braintrust to create unique solutions like these that are designed to meet customers’ needs – current and future.”
BrewerBOND T1100 materials is a thermoplastic thin conformal coating layer applied to the device as an encapsulant. The soluble layer boasts a high softening point with little to no melt flow. BrewerBOND C1300 material is a curable layer that, applied to the carrier, provides high melt flow for easy bonding under low pressure, with no melt flow post-curing. Together, the two layers, which do not intermix or react chemically, enable mechanical stability with no movement of bonding materials and provide thermal stability up to 400ºC.
Other advantages of the dual-layer system include increased throughput and adhesion, reduced baking and cleaning times, and low-temperature bonding (25ºC to ≤100 ºC). End-use targets comprise those that demand high-performance memory and power capabilities; examples include data centers, solid-state drives and automotive applications. Customers have already begun implementing the new BrewerBOND products, and are reporting positive results.
The opportunity for BrewerBUILD materials is evident in customers’ need for an interim packaging solution that will enable them to continue using fan-out techniques but with improved yields and reduced loss of known good die (KGD). RDL-first FOWLP has some advantages over die-first FOWLP. It achieves high-density RDL with smaller-pitch line-space patterning, offers higher performance, has a larger chip size, and can be used for multi-chip integration.
The BrewerBUILD material’s mechanical, thermal and thermal stability is designed to withstand RDL-first process flows. The build-up layer is removed once the carrier is debonded, and the material is compatible with debonding ultraviolet (UV) lasers at wavelengths of 308, 343 and 355 nanometers (nm). The material has already drawn interest from potential customers seeking a transitional packaging solution for a variety of applications.
To learn more about BrewerBOND and BrewerBUILD materials, please visit Brewer Science’s booth N282 at SEMICON Taiwan, September 5-7, 2018, TWTC Nangang Exhibition Hall, Taipei.