May 1 2006
Cree, Inc., a leader in LED solid-state lighting components, today announced the release of its new EZR™ LED chip. This chip provides industry-leading performance for industry-standard side view packages used in mobile LCD backlight applications. The EZR chip will be offered in several brightness bins, including the industry’s first 30-mW bin for very high performance side view applications.
The Cree EZR LED chip is the second product based on Cree’s recently released EZBright™ product platform. The EZR LED chip features low Vf and a proprietary optical design delivering an ideal Lambertian radiation pattern that reduces emission losses and significantly increases efficacy over previous designs. The chip features a rectangular shape, allowing it to be used in thinner packages than those used with square-shaped chips. This development aligns well with industry trends of shrinking package heights for products such as mobile phones, PDAs, DST cameras, MP3 players, and laptop PCs. This is an exciting development for Cree, for our customers, and for the industry. The high performance of this chip should enable our customers to expand their use of white LEDs into applications such as mobile phones and laptop PCs,” notes Scott Schwab, Cree vice president and general manager for LED chips. “In addition, the compatibility of this product with standard epoxy die attach processeshould allow a greater number of customers to use Cree’s high performance chips in white side view packages for the backlighting market. With EZR technology, we expect this chip to enable our customers to deliver white side view LEDs with output of between 1,500 and 2,000 mcd.”
Additional EZBright products are targeted for commercial release over the next several months. Cree is currently taking production orders for EZR and EZBright290™ LED chips.