May 16 2006
Williams Advanced Materials announced today a major expansion of thin film chamber services at its Buffalo, New York facility. Chamber services is an expanding part of WAM's "total service" element for its physical vapor deposition (PVD) base.
The expansion, which includes new capital equipment, will more than double the company's current chamber services capacity. The additional capacity will support the growing needs of WAM's Eastern U.S. customers within the semiconductor, microelectronics and data storage markets. WAM will continue to lead this industry in providing a complete value package of thin film materials, refining and the full range of chamber services.
With more than 10 years of experience providing chamber services and precious metal recovery, WAM augments its metals offering with a full complement of supporting technologies, including: surface treatment technology with various grid blasting grades and twin wire arc spray (TWAS) to meet a wide range of industry certification standards.
"We are pleased to expand our capabilities to grow in step with our customers and maintain our position as the leader in this segment of the thin film market," said Dick Sager, WAM President. He added, "This investment provides our customers an assured availability of chamber services and the benefit of the Williams' reputation for reliability and consistency."
As part of the WAM expansion, plans include additional facilities and technology to be opened in key regions of the globe, with an emphasis in the upcoming months on Eastern Europe and Asia regions.
http://www.beminc.com