Building on its vast experience in high performance materials production, H.C. Starck Solutions provides solutions to the most challenging applications in the electronics industry. The H.C. Starck Solutions supplies custom-engineered thermal management materials, which help the electronics industry maintain its rapid growth driven by increasing miniaturization.
However, this trend leads to greater cooling demands on electronic circuitries. H.C. Starck Solutions’ tungsten and molybdenum materials, engineered composite materials, and laminates are specially designed for these applications.
Advantages of H.C. Starck Solutions Materials
The materials offered by H.C. Starck Solutions exhibit superior thermal properties such as high thermal conductivity and low and controlled coefficient of thermal expansion. The high thermal conductivity of these materials facilitates the rapid removal of heat form high power density devices. With highly experienced engineering staff, H.C. Starck Solutions is well positioned to design highly engineered materials to meet the specific requirements of each application.
CuMoCu laminates from H.C. Starck Solutions demonstrate an adjustable coefficient of thermal expansion comparable to that of silicon and maintain high thermal conductivity, which makes them suitable for power devices that generates considerable amount of heat. The coefficient of thermal expansion and thermal conductivity of H.C. Starck Solutions’ CuMoCu laminates are shown in the following graphs:
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The high tech materials offered by H.C. Starck Solutions demonstrate adjustable coefficient of thermal expansion and thermal conductivity values, low thermal and electrical resistance, and moderate thermal conductivity (Mo = 140-150 W/mk). They are suitable for silicon-based devices and larger area power devices with substantial heat generation.
H.C. Starck Solutions’ Value-Added Products for Power Semiconductors
Developments in electronic controls in high power devices have led to specific demands of the packing materials. Molybdenum and metal-metal matrix composites produced by H.C. Starck Solutions reduce stress in the package while enabling the electronics to run in the desired manner.
Tungsten and molybdenum flat components are largely utilized as contact materials in:
- Heat sink bases in hybrid circuits, LSIs and ICs
- Thyristors (GTOs)
- Transistors
- Silicon controlled rectifiers diodes
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The following are the value-added product solutions offered by H.C. Starck Solutions:
- Discs/Tungsten – Thickness: 0.1 mm - 3.0 mm; diameter: 5.0 mm - 60.0 mm*
- Discs/Molybdenum – Thickness: 0.1 mm - 6.0+ mm; diameter: 1.0 mm - 150.0 mm*
- Squares/Molybdenum and Tungsten – Thickness: 0.01 mm - 3.0+ mm; Width/Length: 0.50 mm - 200.0 mm*
*- depending on thickness
H.C. Starck Solutions’ photo-chemical etching capabilities enable it to fabricate components with outstanding precision, accuracy, repeatability and speed. With large electroplating facilities and electrolytic nickel coatings held to micron thicknesses, the company adds value to the machining and production of molybdenum and other refractory metals.
The choice of different techniques such as rack or barrel plating and physical vapor deposition for single or double-sided coating not only facilitates extensive part size flexibility but also provides volume management capability from single parts to multi-batch.
This information has been sourced, reviewed and adapted from materials provided by H.C. Starck Solutions.
For more information on this source, please visit H.C. Starck Solutions.