Zenite, New Liquid Crystal Polymer Resin Material for Electronic Connectors from DuPont

A new-generation “workhorse” grade of DuPont™ Zenite® LCP liquid crystal polymer resin promises more strength, toughness and precision for electronic connectors and other moulded components.

“Tests demonstrate that connectors moulded from new Zenite® 6130LX provide superior resistance to damage during automated contact insertion and board assembly,” said Bill Hassink, senior development programs manager, DuPont Engineering Polymers.

In testing, the new resin provided a 21 percent improvement in resistance to breakage, a 32 percent increase in deflection before fracture and a less brittle fracture mode. Improvements in strength and toughness are also evident in standard property data.

Moulded connector specimens made of Zenite® 6130LX also showed a marked improvement in knit line strength. When contacts were inserted in test specimens made of an earlier generation LCP, tiny cracks developed at the knit lines. No cracks were discovered in parts moulded from the new resin. Other tests reveal that parts made from the new resin show reduced warp.

Zenite® 6130LX also delivers more resistance to soldering conditions. Its heat deflection temperature of 280°C is 15 degrees higher than that of the earlier generation LCP.

Posted May 4^th, 2004