Written by AZoMApr 25 2001
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Advantages |
| Similar to DAIP, but better resistance to alkalies. |
Disadvantages |
| Similar to DAIP except : Lower temperature resistance (160°C/320°F compared with 180°C/360°F for DAIP). Tensile strength approximately 10% lower than DAIP. |
Applications |
| As for DAIP provided the material is subject to lower operating temperatures. Moulding compound: Electrical connectors, insulators, tool handles, pump impellers. Coating resin: Sealant for metal castings and wood Laminating resin: PCBs, high temp. applications, radomes, trunking |
| Source : Abstracted from Plascams For more information on Plascams please visit RAPRA Technology Ltd. |