Aculon’s non-stick adhesion promotion and anti- oxidation coatings can be used on a broad range of materials used in electronic applications including metals, metal oxides, polymers, and ceramics. Interfacial treatments with adhesion promoters for dissimilar materials are particularly important for performance and reliability in electronics.
Copper adhesion can be particularly troublesome without copper adhesion treatments. Adhesion of low dielectric resins to copper for printed circuit boards and chip scale packaging requires high peel strengths that are obtained through surface treatments of copper. Aculon has demonstrated superior performance to silane adhesion promoters in terms of peel strength on smooth copper (<5 lbs/in), and hydrolytic stability (>600 hours in autoclave).
Aculon’s anti-oxidation coatings have demonstrated that thermal oxidation of copper can be inhibited up to 850°C. Replacement of silver in conductive epoxies, and printing conductive inks is under development.
Metal Lead Frames
Aculon’s adhesion promoters have shown superior bonding of die attach adhesives, and epoxy molding compounds to numerous types of lead frame materials (Au, Pd, Cu, Ag, Ni).
This information has been sourced, reviewed and adapted from materials provided by Aculon.
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