Epoxy MC High Heat; Glass Fibre Reinforced

Aug 20 2001

Advantages

Highest tensile strength, flexural modulus and heat distortion temperature of the epoxy moulding compounds. Generally superior surface finish compared to cast epoxy components.

Disadvantages

Tendency to stick in mould. Highest cost, mould shrinkage and lowest elongation at break compared with other reinforced epoxy moulding compounds.

Typical Properties

Property

Value

Density (g/cm3).

1.9

Surface Hardness

RM110

Tensile Strength (MPa)

72

Flexural Modulus (GPa)

15

Notched Izod (kJ/m)

0.02

Linear Expansion (/°C x 10-5)

2

Elongation at Break (%)

0.6

Strain at Yield (%)

N/A

Max. Operating Temp. (°C)

130

Water Absorption (%)

0.2

Oxygen Index (%)

28

Flammability UL94

V0

Volume Resistivity (log ohm.cm)

15

Dielectric Strength (MV/m)

15

Dissipation Factor1kHz

0.01

Dielectric Constant  1kHz

5

HDT @ 0.45 MPa (°C)

260+

HDT @ 1.80 MPa (°C)

210

Material Drying  hrs @ °C

NA

Melting Temp. Range (°C)

60 -  80

Mould Shrinkage (%)

0.5

Mould Temp. Range (°C)

160 - 190

Applications

Encapsulation of electronic and electrical devices for electrical insulation, physical protection and protection against moisture.

 

Source : Abstracted from Plascams

For more information on Plascams please visit The Rubber and Plastics Research Association

 

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