Written by AZoMAug 21 2001
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Advantages |
Good elongation at break and heat distortion temperature compared with other epoxy moulding compounds. Combined advantage gained from using glass and mineral fillers. Short cycles and ease of handling. Generally superior surface finish compared to cast epoxy components. |
Disadvantages |
Tendency to stick in mould. Expensive with highest density compared with other epoxy moulding compounds. |
Typical Properties |
| Density (g/cm3) | 2 | Surface Hardness | RM110 | Tensile Strength (MPa) | 58 | Flexural Modulus (GPa) | 11 | Notched Izod (kJ/m) | 0.02 | Linear Expansion (/°C x 10-5) | 2.3 | Elongation at Break (%) | 0.8 | Strain at Yield (%) | N/A | Max. Operating Temp. (°C) | 130 | Water Absorption (%) | 0.2 | Oxygen Index (%) | 28 | Flammability UL94 | V0 | Volume Resistivity (log ohm.cm) | 14 | Dielectric Strength (MV/m) | 15 | Dissipation Factor1kHz | 0.06 | Dielectric Constant 1kHz | 5.2 | HDT @ 0.45 MPa (°C) | 260+ | HDT @ 1.80 MPa (°C) | 200 | Material Drying hrs @ °C | NA | Melting Temp. Range (°C) | 60 - 80 | Mould Shrinkage (%) | 0.4 | Mould Temp. Range (°C) | 160 - 190 | |
Applications |
Encapsulation of electronic and electrical devices for electrical insulation, physical protection and protection against moisture. |
Source : Abstracted from Plascams For more information on Plascams please visit The Rubber and Plastics Research Association |