Copper-Manganese (CuMn) Master Alloy

Topics Covered

Introduction
Chemical Composition
Application

Introduction

A master alloy is a combination of base metals such as copper, aluminum, or nickel, and one or two other elements of relatively higher percentage. It is a semi-finished product that is primarily manufactured for use as a raw material. Master alloys can be produced in many shapes. They are designed to improve metallurgy processes by refining the final properties of different metals.

Master alloys are chiefly used in the metal industry. The two main applications are composition adjustment and structure control. These alloys are preferred over pure metals as they are more economical, and save production time and energy as they melt faster in lower temperatures.

Copper-manganese master alloy has the features of copper, which is a soft, conductive, non-ferrous metal. The copper content in this alloy provides it corrosion resistance and ductility. The following datasheet will provide more details about the copper-manganese master alloy.

Chemical Composition

The following table shows the chemical composition of copper-manganese master alloy.

Element Content (%)
Copper, Cu 79-81
Manganese, Mn 19-21
Iron, Fe 0.20 max
Nickel, Ni 0.20 max
Zinc, Zn 0.10 max
Lead, Pb 0.05 max
Tin, Sn 0.05 max
Silicon, Si 0.03 max
Phosphorus, P 0.02 max
Carbon, C 0.02 max
Antimony, Sb 0.01 max
Arsenic, As 0.01 max
Sulfur, S 0.01 max
Tellurium, Te 0.005 max
Selenium, Se 0.005 max
Bismuth, Bi 0.005 max
Others 0.50 max

Application

Copper-manganese master alloy is applied for improving the mechanical properties and corrosion resistance of low alloyed copper and enhancing the mechanical properties and corrosion resistance of brass alloys.

This alloy is also used in a deoxidizer, a desulfurizer for copper-nickel alloys and copper-nickel-zinc alloys, and for influencing the electrical conductivity and magnetic properties of aluminum bronze.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this article?

Leave your feedback
Submit