Copper alloys are metal alloys that have the metal copper as their chief component. There are about 400 types of copper alloys. A Unified Numbering System (UNS) has been developed for metals and alloys by American Society for Testing and Materials (ASTM) and Society of Automotive Engineers (SAE).
Copper alloys are alloys consisting of primarily copper, combined with different alloying elements, thereby producing an entirely new range of materials. Each of these materials is designed to maximize a particular characteristic such as ductility, formability, strength.
Although copper and nickel play a predominant role, many other elements are also added in small quantities into the composition of copper-nickel alloys, thus providing a range of copper-nickel alloys or cupronickel alloys with different properties to suit a wide range of applications.
Copper is a reddish brown metal. It is one of the first metals extracted and used by man. When copper is combined with other metals such as zinc, tin, silicon, and lead, copper alloys are formed.
UNS C72700 is a copper-nickel alloy that is widely used in marine applications due to its good corrosion resistance, strength, and high inherent resistance to biofouling.
Copper is found in minerals such as bornite, chalcopyrite, azurite, malachite and cuprite. The different grades of unalloyed copper vary in the amount of impurities and hence they behave differently.
Copper and its alloys are the most versatile engineering materials. The major uses of pure, unalloyed copper are based on the high electrical and thermal conductivity of copper.
Mid-Infrared (Mid-IR) spectroscopy is a technique which is often employed for lubricant formulation and evaluation as it provides a comprehensive data on chemical composition.
With technological advancements in 3D printing it won’t be long until we see 3D printers becoming more commercial and being a part of consumer homes.
By Kris Walker
25 Jul 2013
Confocal sputtering technique involves the arrangement of magnetrons inside a vacuum chamber so that it is possible to apply multiple materials onto the substrate without breaking vacuum.