Leading producer of specialty polymer-coated and calendered materials, Trelleborg, will showcase a selection of its specialist range of solutions at the international trade fair for technical textiles and non-wovens, Techtextil.
In preparation for a future where parts and tools can be printed on demand in space, NASA and Made in Space Inc. of Mountain View, Calif., have joined to launch equipment for the first 3-D microgravity printing experiment to the International Space Station.
Dongbu HiTek today announced the opening of sales/marketing offices in Shanghai and Beijing with plans to open another soon in Shenzhen. The company’s bold move signals how important the rapidly growing Chinese fabless market is to its foundry business.
Pulse Electronics Corporation, a leading provider of electronic components, today announced it has implemented significant changes to its manufacturing strategy resulting in a reduction in product lead-time to 4-5 weeks. This represents a 50% reduction over typical industry lead-times of 8-10 weeks. A majority of Pulse’s products are included in the program.
GKN Sinter Metals plans a $10 million expansion of its Gallipolis production facility in southeastern Ohio’s Gallia County.
Though its surface has been turned to carbon, the bunny-like features can still be easily observed with a microscope. This rabbit sculpture, the size of a typical bacterium, is one of several whimsical shapes created by a team of Japanese scientists using a new material that can be molded into complex, highly conductive 3-D structures with features just a few micrometers across.
The semiconductor industry’s march toward broader 3D IC integration marked animportant milestone this week at the 2013Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processingsession, when Ranjith John, materials development & integration engineer at Dow Corning, presented a paper co-authored by Dow Corning, a global leader in silicones, silicon-based technology and innovation, and SÜSS MicroTec, a leading supplier of semiconductor processing equipment.
Punching a large number of holes in thin sheet metal, without distorting the panel, and that in a single pass - that is now possible thanks to the new integrated flattening concept by TRUMPF. In the standard punching process, the punch draws material into the hole as it penetrates the sheet. That makes for compressive stress then, and tensile stress when the punch is withdrawn.
At the annual 2013 ASMS conference (9-13 June 2013, Minneapolis, Minnesota) Conquer Scientific will be available to discuss the options of pre-owned mass specs for laboratories with tight budgets or ones looking to get the most for their funds.
Intertronics’ introduction of the new Liquidyn P-Jet CT Jetting Valve brings to manufacturers the capability for high performance micro-dispensing of materials such as oils, greases, adhesives, silicones, paints, flux, pharmaceutical media and other chemicals, including filled fluids.
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