The European Powder Metallurgy Association has issued a call for papers for a powder metallurgy event to be held at the Euro PM2013 International Powder Metallurgy Congress and Exhibition between 15 and 18 Sep 2013. The event will cover hard materials and diamond tools, PM structural parts, hot isostatic pressing, powder injection and molding and new materials and applications.
BASF is investing approximately €90 million in the first step to build a mobile emissions catalysts production facility in Œroda Œl¹ska, a Special Economic Zone near Wroc³aw, Poland. Construction of the new 40,000 square meter facility – BASF’s largest in Europe – will begin before the end of 2012.
Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced it has more than doubled production of bonded silicon-on-sapphire (BSOS) substrates to meet increased demand from its strategic partner, Peregrine Semiconductor Corporation (NASDAQ: PSMI).
Now, contractors sealing housewrap materials have a solvent-free housewrap tape option that holds strong and lasts strip after strip to prevent air and moisture infiltration. Shurtape®, with its commitment to exacting standards, introduces new HW 300 housewrap tape, a water-based closure tape for housewrap materials used in residential and commercial construction applications.
BASF plans to divest its subsidiary BASF Wall Systems GmbH & Co. KG, together with the Marktredwitz site. Currently, BASF Wall Systems GmbH & Co. KG has approximately 190 employees, who will continue to be employed by the new owner.
Air Products (NYSE:APD) will showcase its range of MAXX™ shielding gases—designed for improved welding safety, quality and productivity—as well as the company’s assist gases for high-performance laser cutting at this year’s FABTECH show in Las Vegas, Nev., from November 12-14.
NTM Sensors, a division of NexTech Materials, Ltd., is pleased to announce that it has been awarded funding by the U.S. Department of Energy’s Advanced Research Projects Agency (ARPA-E) to develop and demonstrate monitoring systems that improve the safety and extend the operating limits of advanced batteries.
Imec announces that it has designed and fabricated an electrostatic micro-lens (lenslet) array for KLA-Tencor’s anticipated Reflective Electron Beam Lithography (REBL) tool. The REBL technology potentially enables a high throughput e-beam writing process for maskless lithography.
Tokyo-based Teijin Chemicals Ltd., the core company of the Teijin Group's resin and plastic processing business, announced today that sales of ELECLEAR, the company's transparent conductive film for use in touchscreens, have more than doubled since last year, supported by growing demand not only for capacitive touchscreens in smartphones and tablets, but also resistive touchscreens, particularly those with high durability found in car navigation systems, portable gaming devices and OA equipment.
Vishay Intertechnology, Inc. (NYSE: VSH) today announced a new series of snap-in power aluminum capacitors with a rated voltage of 500 V at 50 °C and a category voltage of 450 V at 105 °C.
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