Loughborough University researchers have been awarded more than £200,000 to develop state-of-the-art tailor made implants for people requiring facial reconstructive surgery.
The Department of Health’s &lsq...
Scientists from the U.S. Department of Energy’s Brookhaven National Laboratory and the University of Florida have uncovered information that may help “molecular wires” replace silicon in micro-electroni...
Canadian researchers have shown that nanotechnology can be used to pave the way to a supercharged Internet based entirely on light. The discovery could lead to a network 100 times faster than today’s
In a study ...
The Free-Electron Laser (FEL), supported by the Office of Naval Research and located at the U.S. Department of Energy's Thomas Jefferson National Accelerator Facility, achieved 10 kilowatts of infrared laser light in...
A significant breakthrough in the development of the highly prized semiconductor gallium nitride as a building block for nanotechnology has been achieved by a team of scientists with the U.S. Department of Energy's L...
Cree, Inc. today announced that its 7090 series XLampTM, a solid-state light emitting diode (LED) product, is now available in production quantities. This is the first high-powered packaged LED product that Cree has rele...
A research team at Rensselaer Polytechnic Institute has created a new type of reflector that has dramatically improved LED (light-emitting diodes) luminance. The National Science Foundation (NSF) recently awarded the res...
3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 2...
Nitronex Corporation, a pioneer in the development of Gallium Nitride (GaN) on Silicon technology, is pleased to announce it is now offering GaN epitaxial wafers for sale. By offering access to its material platform tech...
3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 2...
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