Metryx, Limited, today announced that it has shipped its second Mentor OC23 mass metrology system to a key U.S.-based GaAs manufacturer.
The company will implement the system in volume bulk acoustic wave (BAW) device ...
New methods for exploring the behavior of the high-performance electronics materials and devices that will shape the future of the electronics industry will be the focus of the International Conference on Frontiers of Ch...
Showa Denko K.K. (SDK) has developed a new grade of SCMG(TM) (shape-controlled micro graphite) to be used as anode material in large lithium-ion batteries for electric vehicles (EVs).
Since the material has been adop...
Today, IMEC presented the world's first functional 22nm CMOS SRAM cells made using EUV lithography. The 0.099µm² SRAM cells are made with FinFETs and have both the contact and metal1 layer printed using AS...
FUJIFILM Corporation is pleased to announce the introduction of ETERNA Vivid*2 500,a new tungstentype motion picture color negative film (E.I. 500; 35mm/16mm) formulated to offer high color saturation and high contrast. ...
A research team from Northeastern University and the National Institute of Standards and Technology (NIST) has discovered, serendipitously, that a residue of a process used to build arrays of titania nanotubes-a residue that wasn't even noticed before this-plays an important role in improving the performance of the nanotubes in solar cells that produce hydrogen gas from water.
A tendon can be one of the most common and frustrating injuries for an athlete - often forcing them to stay away from the sports field for up to eight weeks. But now the pioneering research of a University of Manchester student could be about to speed up the recovery process.
AIXTRON AG announced the receipt of a purchase order for a 4" Black Magic PECVD for carbon nanotube (CNT) growth from The Georgia Institute of Technology (GaTech) in Atlanta, GA, USA within the first quarter 2009.
...
Rudolph Technologies, Inc. (NASDAQ: RTEC) and SEMATECH, the global consortium of leading chipmakers, announced today that Rudolph has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and ...
Researchers at Carnegie Mellon University's School of Computer Science have developed a new method for systematically identifying bugs in aircraft collision avoidance systems, high-speed train controls and other comp...
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