Posted in | Semiconductor

SUSS MicroTec to Wins Head to Head Wafer Characterization Reliability Test

SUSS MicroTec Test Systems has announced that it has once again won a head-to-head evaluation with its unique PA300PS with ProbeShield Technology, the 300 mm wafer-level probe system for device characterization and reliability test.

The evaluation took place at a major integrated device manufacturer (IDM) located in the United States. As the winner of the evaluation, SUSS MicroTec has been named the exclusive supplier of on-wafer characterization systems for three years and is committed to work diligently in maintaining this position for many years beyond. As expected, the manufacturer has already placed the first system order.

The decision follows a comprehensive, head-to-head comparison against the major suppliers of wafer-level test solutions at the manufacturer's facilities. In the evaluation, all systems were simultaneously compared in the same laboratory using several benchmarks. These consisted mainly of advanced tests of semiconductor devices, such as flicker noise, I-V, C-V and S-parameter measurements, which are used to extract critical parameters in the device design and process control phases. SUSS MicroTec's ProbeShield Technology consistently outperformed the competitive solutions, leading to its ultimate selection.

"The engineers at the manufacturer chose ProbeShield Technology due to the superior positioning accuracy especially on small pads and significant time savings provided by advanced automation features such as ReAlign Technology for automatic alignment of probe tips to pads after a temperature change," said Rick Dock, Vice President of North American Sales at SUSS MicroTec. "We are very excited about this particular win; it has validated the significance of both measurement accuracy and thermal automation when characterizing devices. This was just one of the many ways SUSS MicroTec demonstrated significant and tangible value when compared to the competition through our superior solutions and world-class customer support."

http://www.suss.com

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    SUSS MicroTec AG. (2019, February 10). SUSS MicroTec to Wins Head to Head Wafer Characterization Reliability Test. AZoM. Retrieved on May 31, 2020 from https://www.azom.com/news.aspx?newsID=16843.

  • MLA

    SUSS MicroTec AG. "SUSS MicroTec to Wins Head to Head Wafer Characterization Reliability Test". AZoM. 31 May 2020. <https://www.azom.com/news.aspx?newsID=16843>.

  • Chicago

    SUSS MicroTec AG. "SUSS MicroTec to Wins Head to Head Wafer Characterization Reliability Test". AZoM. https://www.azom.com/news.aspx?newsID=16843. (accessed May 31, 2020).

  • Harvard

    SUSS MicroTec AG. 2019. SUSS MicroTec to Wins Head to Head Wafer Characterization Reliability Test. AZoM, viewed 31 May 2020, https://www.azom.com/news.aspx?newsID=16843.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Submit