Posted in | Semiconductor | New Product

Dow Releases New Polishing Pads for CMP Applications

Dow Electronic Materials (NYSE:DOW), a leader and innovator in chemical mechanical planarization (CMP) technology for the global semiconductor industry, today introduced its latest VISIONPAD polishing pads VISIONPAD 6000 and VISIONPAD 5200.

These new polishing pads further extend Dow's ability to offer customers application-specific solutions targeted at technology improvements for polishing at advanced nodes and improved productivity at existing nodes. VISIONPAD 6000 and VISIONPAD 5200 are currently in production and are in qualification with multiple customers.

"Dow's VISIONPAD polishing pad series offers the industry an unparalleled CMP platform specifically designed for current and next-generation manufacturing," said Austin Chen, South Asia Regional General Manager for Dow Electronic Materials. "Our innovative R&D drove the development of the VISIONPAD platform, which gives us the ability to offer the right pad for specific CMP applications. These VISIONPAD polishing pads are higher-performing and allow for reduced consumable costs."

VISIONPAD 6000 polishing pads deliver leading-edge technology designed specifically to improve defectivity and dishing for inter-layer dielectrics (ILD) and Copper (Cu) bulk applications. VISIONPAD 6000 polishing pads are engineered with a low-defect, low-hardness polymer chemistry and optimized pore size, which deliver improved defectivity and dishing and can exceed the removal rates of the IC1000 polishing pads. In customer testing VISIONPAD 6000 demonstrated a 50 to 60 percent reduction in scratch defects, a 35 percent reduction in dishing and equivalent wafer non-uniformity to the IC1000 polishing pads.

VISIONPAD 5200 polishing pads offer next-generation technology that achieves a high removal rate for Tungsten (W), ILD and Cu bulk processes. VISIONPAD 5200 polishing pads implement unique polymer chemistry and higher pad porosity that achieve a 10 to 30 percent increase in removal rate for W, ILD and Cu Bulk applications. This increased removal rate allows the customer to reduce polishing times and slurry consumption to significantly lower CMP cost of consumables. VISIONPAD 5200 polishing pads also offer a 10 to 20 percent reduction in defectivity in W and Cu applications, and improved dishing and erosion in W applications over Dow's standard IC1000 polishing pads.

"Our ability to both develop advanced technologies like VISIONPAD polishing pads and deliver them in high volumes thanks to our global manufacturing capabilities are critical differentiators that Dow brings to the global semiconductor manufacturing market," concluded Chen.

To provide the highest quality and consistency, all VISIONPAD products are manufactured using stringent SPC/SQC methods at Dow's high volume manufacturing facilities in Taiwan, the United States and Japan.

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