Dow Electronic Materials, a business unit of The Dow Chemical Company, announced today that its MICROFILL™ THF-100 Electrolytic Copper received the New Product Introduction (NPI) Award from Printed Circuit Design and Fab Magazine (PCD&F) in the plating category.
MICROFILLTHF-100 Electrolytic Copper is recognized as a value-added solution to enable the miniaturization of next generation devices. It delivers enhanced performance and high reliability through a shortened manufacturing process.
Dow’s new products have won five NPI awards from PCD&F in the Desmear, Final Finishes, Electrolytic Plating and Imaging categories since 2009. “We are pleased to extend our congratulations to Dow for winning the NPI Award again,” said Mike Buetow, Editor-in-chief of PCD&F. “Dow MICROFILLTHF-100 Electrolytic Copper for through-hole fill of substrate core layers was hands-down the most innovative product in the plating category.” The NPI Award, in its sixth year, recognizes the leading new products from the previous year. Awards are selected by an independent panel of industry engineers.
“Receiving the award again demonstrates our tremendous efforts to innovate with customers for advances in the electronics industry,” said JR Chen, Global Business Director for Dow Electronic Materials. “As smartphones and tablets become the primary driver for the ever-increasing circuit density of today’s printed circuit board designs, MICROFILLTHF-100 Electrolytic Copper can help meet customers’ needs for high density interconnect solutions. With our exceptional technology capability and outstanding customer support, we are committed to making our customers successful.”
Dow Electronic Materials will showcase MICROFILLTHF-100 Electrolytic Copper and other innovations at the following coming shows:
- CTEX Suzhou PCB/SMT Show: Booth #AW11, Hall 4A, Suzhou International Expo Center, China, May 8-10, 2013.
- JPCA Show: Booth# 2B04, East Hall 2, Tokyo Big Sight, Japan, June 5-7, 2013.