FSI International, developer of surface conditioning machines for microelectronics segment, declared that it has received additional purchase orders from a major logic device manufacturer in Asia for multiple ANTARES CryoKinetic cleaning equipment. The systems are likely to be delivered in the Q2 and Q3 of 2011.
Presently, the ANTARES CryoKinetic system has been deployed by the logic device manufacturer for several processes related to BEOL particle removal such as inline probe testing. When compared to aqueous technologies, Cryokinetic cleaning technology is exclusively developed for particle removal application since it includes all-dry fault removal method.
The single-wafer ANTARES CryoKinetic system is a complete automatic system. It can process 200/300 mm wafers and eliminate even nano particles. The all-dry, non-responsive process eradicates particles via contact with high-speed cryogenic Ar/N2 aerosol, and minimizes imperfections without disturbing the wafer exterior.
The highly effective dry cleaning solution in the system can be utilized for several applications related to particle elimination in BEOL and FEOL. Several global developers of logic devices use the ANTARES system for its imperfection minimization and production enhancement.