Semiconductor Packaging Solutions Provider Breaks Ground for New Factory

STATS ChipPAC, a provider of semiconductor advanced packaging and test solutions, has conducted the groundbreaking ceremony for its new plant to be built close to its existing facility in Yishun, Singapore, to expand its production capabilities for sophisticated wafer level technologies such as through silicon via (TSV), integrated passive devices (IPD), wafer level chip scale packaging (WLCSP) and embedded wafer level ball grid array (eWLB).

Roughly $250 million had been invested by STATS ChipPAC in Singapore in the past three years to augment its production capacity and technology offering. The company plans to make an additional investment of $220 million in the country in the coming several years.

Demand for wafer level packaging has surpassed the existing market capacity. STATS ChipPAC has developed a broad array of sophisticated package architectures and process capabilities for high-performance consumer and mobile applications as a result of its efforts in the advancement of wafer level technologies.

The new factory spanning 197,000 sq. ft. is scheduled for operation by the fourth quarter of fiscal year 2012. The new factory will increase the production space of STATS ChipPAC in Singapore from 595,000 to 792,000 sq. ft.

STATS ChipPAC’s President and Chief Executive Officer, Tan Lay Koon stated that sophisticated wafer level technologies are vital to meet the needs of the company’s customers for improved functionality and performance in a compact size for advanced electronic devices such as tablets and smartphones. The worldwide production base expansion in sophisticated wafer level packaging will extend the company’s dominance in these technologies, he added.


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