Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today at Bondexpo two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies.
The new silicone technologies include Dow Corning® TC-2030 Thermally Conductive Adhesive, the company’s most advanced solution for traditional automotive electronics applications, and Dow Corning® TC-2035 Thermally Conductive Adhesive, a high-performance thermal interface material for high-heat automotive applications, such as next-generation power electronic modules. Both materials as well as other products from Dow Corning’s expansive portfolio of thermal management solutions are being featured here at the company’s stand (7518, hall 7).
“It’s no understatement to say that the growth of automotive electronics is booming, resulting in unrelenting pressure on automotive electronics designers to push the functionality, reliability and overall performance of their products as hard and as far as they can,” said Brice Le Gouic, global market manager for Transportation Electronics, Dow Corning. “With the launch of our innovative new Dow Corning TC-2030 and TC-2035 Thermally Conductive Adhesives, we offer the industry one of the most comprehensive thermal management portfolios for both standard electronics and next-generation, high-power electronic assemblies.”
Dow Corning TC-2030 Thermally Conductive Adhesive
Dow Corning TC-2030 Thermally Conductive Adhesive is the company’s most advanced thermal management solution for standard automotive electronics. Formulated with field-proven thermally conductive fillers, it reduces thermal resistivity with a high thermal conductivity of 2.7 W/mK. A two-part, heat-cured silicone technology, Dow Corning TC-2030 Thermally Conductive Adhesive delivers a significant improvement in elongation performance for a material of such high thermal conductivity. Thus, it enables thermal interfaces that deliver full and effective contact to ensure stable performance over a module’s expected lifetime. Delivering bond line thickness (BLT) of 130 microns (µm), this advanced technology is a suitable thermal interface material for high-power underhood electronic applications, such as power steering, antilock breaking and electronic control modules.
Dow Corning TC-2035 Thermally Conductive Adhesive
New Dow Corning TC-2035 Thermally Conductive Adhesive dramatically raises the bar on managing heat in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles. This cutting-edge material drastically reduces thermal resistivity by delivering excellent 3.3 W/mK thermal conductivity and BLT as low as 50 µm. A two-part, heat-cured silicone, Dow Corning TC-2035 Thermally Conductive Adhesive bonds reliably to a variety of thermal substrate types, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit board. Further, the material sustains reliable performance at temperatures reaching 200° C.
Dow Corning TC-2030 and TC-2035 Thermally Conductive Adhesives are available from Dow Corning worldwide. Specially designed to address thermal challenges faced in many of today’s most demanding electronics applications, these high-performance materials round out Dow Corning’s broad and expanding portfolio of advanced solutions for thermal management. In addition to thermal silicone adhesives, the company offers a full line of innovative solutions and expertise to meet critical industry needs. To learn more about Dow Corning’s advanced silicone technologies for thermal management and other applications, please visit dowcorning.com/electronics.