Dec 22 2005
Tegal Corporation today announced that a US-based technology company has placed an order for 6540 advanced etch system for the development of RRAM (Resistive Random Access Memory) devices incorporating certain unique new materials. The recertified 6540 advanced etch system is valued at over $1.5 million and will be delivered to the customer this month.
The development program is aimed at producing non-volatile, high-density memory cells separately from logic devices for system-on-chip applications. RRAM development is a focus for several device manufacturers because of its ideal attributes for high density, low cost and low power consumption.
“Tegal is the leading company in plasma etch technology for several types of non-volatile memory devices, such as FeRAM, MRAM, RRAM and polymeric memories,” said Murali Narasimhan, Tegal’s recently appointed Vice President of Marketing. “We announced an order earlier this year for an Endeavor PVD system which was delivered to another company pursuing RRAM development. Tegal is uniquely positioned to provide both etch and deposition solutions in this emerging market.”
The Tegal 6540 used in this application features the unique dual-frequency Hre- etch process module upgraded with a high temperature ESC capable of processing at wafer temperatures as high as 500C. This extended temperature range enhances the removal of hard-to-etch metals and metal oxide films without re-deposition on the surface of the device.