This week, XYZTEC is exhibiting the Condor Sigma at Semicon Taiwan. With two booths at the central TWTC Nangang Hall (4F), the market leader in bond testing is attracting a lot of attention. Many customers are automating their facilities and therefore come to see the latest advances in automation that the Condor Sigma and the 300mm (12 inch) wafer testing Condor Sigma W12 have to offer.
The unique solutions for wafer handler (EFEM) integration, the highly effective warped wafer pusher and the patented contactless CBP Jaw Cleaner prove to be the most popular features that help semiconductor companies to improve their throughput and efficiency.
The show at the Taipei Nangang Exhibition Center in Taiwan is expected to attract 43,000 visitors until Friday September 9th, 4PM. Everyone with an interest in bond testing is invited to come to one of our booths and see the Condor Sigma in action.
Our goal is to make bond testing more accurate, more reliable, easier and more cost effective!
XYZTEC, incorporated in 2000, designs and manufactures innovative equipment that is used for quality assurance to ensure the reliability of many products in multiple industries. We set the standard in Statistical Process Control (SPC). We are 100% focused on bond testing and have established our name as technology leader inbond testing worldwide.