SHENMAO America, Inc. is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.
SHENMAO’s PF606-F13 lead-free and halogen-free solder wire is designed for automatic soldering equipment. It improves the working environment for a variety of automatic soldering applications, including: TPC soldering, buzzer, bending element, LCD panel, embedded element, solder joints, wire soldering, button, screen connector and FPC soldering. Benefits include:
- Improve workers' working environment
- Reduce the technical requirements of manual operation
- Enhance high-precision soldering
- Stable soldering quality
- Enhance soldering efficiency
- Mass production
PQ10 series low temperature solder paste is made with the modified Sn/Bi alloy with lower melting point range from 137~142°C to 137~170°C. In comparison with SnAgCu, PQ10 offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components. In comparison with the Sn42/Bi58 Eutectic alloy, PQ10 series offers better ductility, finer microstructure, and increased drop and thermal reliability.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
For more information, please visit www.shenmao.com.