IBL Technologies to Discuss Vapor Phase Soldering at SMTconnect

IBL Technologies, LLC today announced plans to exhibit at SMTconnect, scheduled to take place May 7-9, 2019 at the NurnbergMesse GmbH in Nuremberg, Germany. Company representatives will discuss the BLC 420 Batch Soldering Machine in Hall 4, Stand 205 and Hall 5, 434B.

The BLC reflow vapor phase soldering system is perfect for medium to high volume production, batch and inline machines. The machines offer the highest quality performance with the smallest footprint. Many patented features are available and provide a wide range of flexibility, including:

  • Small footprint
  • Low power consumption
  • Real time temperature profiling
  • Intelligent Profiling System
  • Excellent solder quality
  • Fast setup
  • One profile for most operations

IBL Technologies offers a full line of single vapor batch and inline type reflow systems.

Source: http://ibl-tech.com/en/

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