Applied Materials to Collaborate with TSMC on Next Generation Copper Chips

Applied Materials and Taiwan Semiconductor Manufacturing Company (TMSC) have entered into a joint development agreement.

Under the agreement TSMC will develop the next generation of copper chips using Applied Materials’ new SlimCell ™ Electrochemical Plating (ECP) system, a technology has been shown to reduce defects.

SlimCell ECP differs from other systems in that it uses a small chemical bath design that is claimed to increase its technical capability, repeatability and production worthiness. It features a small volume-plating cell linked to a chemical tank, which is replaced after a set number of wafers have been processed. The design increases repeatability and reduces costs.

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