Posted in | Sensors

MicroProf® with Equipment Front End Module (EFEM)

The standard fully automated wafer metrology tools – FE, FS, AP, and DI -  combine the capabilities of the worldwide established MicroProf® 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and long-lasting components, the MicroProf® with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different  3D packaging process steps (AP) or comprehensive defect inspection applications (DI).

The standard fully automated wafer metrology tools – FE, FS, AP, and DI -  combine the capabilities of the worldwide established MicroProf® 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and long-lasting components, the MicroProf® with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different  3D packaging process steps (AP) or comprehensive defect inspection applications (DI).

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