Phenolic - PF Phenol Formaldehyde Paper

Aug 21 2001

Advantages

Cheapest and lowest S.G. compared with other phenolic laminates in Plascams.

Disadvantages

Lowest maximum operating temperature, notched izod impact strength and heat distortion temperature compared with other phenolic laminates in Plascams.

Typical Properties

Property

Value

Density  (g/cm3)

1.32

Surface Hardness

RM110

Tensile Strength (MPa)

90

Flexural Modulus (GPa)

8.2

Notched Izod (kJ/m)

0.024

Linear Expansion (/°C x 10-5)

2

Elongation at Break (%)

1

Strain at Yield (%)

N/A

Max. Operating Temp. (°C)

90

Water Absorption (%)

0.25

Oxygen Index (%)

25

Flammability UL94

HB

Volume Resistivity (log ohm.cm)

10

Dielectric Strength (MV/m)

15

Dissipation Factor1kHz

0.037

Dielectric Constant  1kHz

5.1

HDT @ 0.45 MPa (°C)

260+

HDT @ 1.80 MPa (°C)

160

Material Drying  hrs @ °C

NA

Melting Temp. Range (°C)

NA

Mould Shrinkage (%)

NA

Mould Temp. Range (°C)

NA

Applications

General industrial use. Printed circuit boards.

 

Source : Abstracted from Plascams

For more information on Plascams please visit The Rubber and Plastics Research Association

 

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