With time and money tighter than ever, waterjet shops across the globe are looking for ways to maximize the productivity and profitability of their waterjet systems without spending too much on capital investments.
Jeff Schibley of Jet Edge advises that before investing in a waterjet system, the waterjet manufacturer needs to perform a test cut. Using material supplied by the customer, most waterjet manufacturers provide free test cuts.
Traditionally, it has always been thought that the interactions between a 2-dimensional (2D) material and another solid substrate adhered through conventional solid-solid interactions.
When evaluating resistance to scratch and mar, the objective is to make certain the product maintains a minimum visual appearance over its estimated life. Regardless of whether the coating is for cosmetic appeal or functional performance, surface damage detracts from the products value.
In the world of materials sciences, metal fatigue describes the weakening of a material that occurs as a result of being exposed to repeated applied work or stress loads.
By Benedette Cuffari
16 Mar 2017
Since the development of graphene and the discovery that its electrons act as Dirac fermions, many other 2D materials have been investigated.
By Liam Critchley
14 Mar 2017
The design and printing of 3-dimensional (3D) networks has gained significant interest in recent years, particularly in the area of drug dosage development.
By Liam Critchley
13 Mar 2017
Unlike naturally occurring dense ceramics, man-made ceramics often require sintering temperature in excess of 1400 °C for densification to occur.
By Liam Critchley
13 Mar 2017
In what has been described has the worst environmental disaster to ever occur in the history of the United States on April 20, 2010, the BP Oil Spill involved a continuous spillage of an estimated 205.8 million gallons of oil and methane gas into the Gulf of Mexico for a duration of 87 straight days
By Benedette Cuffari
14 Mar 2017
3D optical profiling provides many benefits over other measurement methods used for non-contact inspection of semiconductor packaging front-end process research and control.