Diversified industrial manufacturer Eaton Corporation today announced that its HAYFLOW filter element has been named An Eaton Green Solution. This designation is Eaton’s promise of exceptional, documented environmental performance to customers, consumers and our communities.
MCW Energy Group Limited, ("MCW"), a Canadian holding company involved in fuel distribution and the creation of oil sands extraction technology, today announced that a corporate profile story on MCW is currently appearing in the February 2013 issue of the International Resource Journal (IRJ), a major electronic resource publication distributed online to top executives worldwide.
FlexTech Alliance today announced the recipients of the 2013 FLEXI Awards. American Semiconductor, Corning Incorporated, and Plastic Logic were recognized for significant contributions to innovation and R&D.
Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The Dow Chemical Company, today launched the first pads from its new IKONIC™ 2000 and IKONIC™ 3000 polishing pad series.
Electro Scientific Industries, Inc., a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that its DiamondBlaze™ product line cuts Corning’s line of chemically strengthened glass products including Corning® Concore™ Glass and its next generation of damage-resistant glasses for Integrated Touch Cover Glass applications.
American Semiconductor, Inc. announces TowerJazz, the global specialty foundry leader, is the first foundry with a CMOS process (CS18) available for physically flexible wafers and integrated circuits (ICs) utilizing FleX™ Silicon-on-Polymer.™ This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance being held in Phoenix, Arizona on January 29 - February 1, 2013.
Raytheon today officially "opened for business" a new UK-leading silicon carbide manufacturing "foundry" facility, developed through several years' research into advanced manufacturing processes and materials science. The application of silicon carbide in electronic systems will place the UK in a leading position to develop next-generation, high-efficiency, smaller, low-weight power conversion products used in harsh environments across the automotive, aerospace, geothermal explorations, oil and gas, and clean energy sectors.
New York University physicists have developed a method for moving microscopic particles with the flick of a light switch. Their work, reported in the journal Science, relies on a blue light to prompt colloids to move and then assemble—much like birds flock and move together in flight.
Pulse Electronics Corporation, a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors.
C. Grant Willson, professor of chemistry and chemical engineering at The University of Texas at Austin, has won the Japan Prize, an international award similar to the Nobel Prize, for his development of a process that is now used to manufacture nearly all of the microprocessors and memory chips in the world.
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