Weller, a global brand of Apex Tool Group known for innovative soldering solutions, today announced the launch of the WXD 2, a two channel, 255 watt soldering and desoldering station. The WXD 2 features the new WXDP desoldering tool with 120 watts of power, a 35-second heat-up time, quick replacement filter cartridge and XDS nozzles with extended nozzle shafts to minimize tip cleaning.
Technic Inc. has announced the commercial release of its Goldeneye Barrier Layer System specifically engineered for improved corrosion resistance in high speed reel-to-reel connector applications.
Turning lignin, a plant's structural "glue" and a byproduct of the paper and pulp industry, into something considerably more valuable is driving a research effort headed by Amit Naskar of Oak Ridge National Laboratory.
Agilent Technologies Inc. announces the launch of its online Pico Café, an interactive web community created exclusively for atomic force microscope users.
Agilent AFM users from around the world are invited to v...
The European Powder Metallurgy Association (EPMA) has launched a new brand to promote the range of applications where powder metallurgy (PM) can be used. The 'International Spotlight on Powder Metallurgy', recently launched at the Euro PM2012 Congress & Exhibition, provides a comprehensive and relevant body of material in showcasing the capabilities of PM in end user applications.
Research and Markets has announced the addition of the "Metal Coating, Engraving & Heat Treating" report to their offering.
Objet Ltd., the innovation leader in 3D printing for rapid prototyping and additive manufacturing, today announced the release of a new and improved Objet Rigid Black Material. The new material provides enhanced dimensional stability and surface smoothness making it ideal for fine detail, all-purpose rapid prototyping.
Engineers pave the way towards 3D printing of personal electronics Scientists are developing new materials which could one day allow people to print out custom-designed personal electronics such as games controllers which perfectly fit their hand shape.
Forging dies must withstand a lot. They must be hard so that their surface does not get too worn out and is able to last through great changes in temperature and handle the impactful blows of the forge. However, the harder a material is, the more brittle it becomes - and forging dies are less able to handle the stress from the impact.
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today introduced an 80nm SDDI (Small-panel Display Driver IC) foundry process with the most competitive SDDI SRAM bitcell in the foundry industry. The low power, advanced SRAM solution applies aggressive foundry design rules to shrink the bitcell size down to 0.714 um square to enable HD720/WXGA smartphone resolutions, far less than the typical 0.81um square size used in current 80nm SDDI processes. The process is ready for mass production, with several Tier-1 customers engaged for HD720/WXGA smartphone resolution applications.
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