Next week the IDTechEx Printed Electronics USA 2013 event will open in Santa Clara, CA, to more than 160 exhibitors and over 1,800 pre-registered attendees. The event, which is over 20% bigger than last year at this poin...
High reliability strip connectors using ruggedized insulators and military quality Flex Pin® technology are focused on providing the best and strongest strip-style interconnections in the world. These units have proven both signal integrity and reliability in many of the most demanding instruments, including mission critical portable electronics for armed forces' systems.
PRO DESIGN, veteran in the EMS and EDA industry, today announced the launch of its proFPGA duo V7 Prototyping System, a high performance, modular, flexible and cost efficient solution, which fulfils highest demands in the area of ASIC & SoC Prototyping.
Optomec announced today availability of a new entry-level offering in its lineup of systems for printed electronics, the Aerosol Jet 200 benchtop. This new system is built using Optomec’s patented Aerosol Jet core technology, but in a benchtop form factor ideally suited for research applications, such as prototyping small electronic devices, or developing and certifying new printable inks.
Seagate Technology plc today announced that its Samsung® HDD division is shipping the new 2.5-inch Spinpoint™ M9T, which at 9.5 mm thin is the world's thinnest 2TB hard drive. Offered in capacities of 1.5TB and 2TB, the Spinpoint M9T mobile drive gives OEMs, channel system integrators and consumers a thin, high-capacity storage solution ideal for external storage, notebook integration and upgrades, desktop, and gaming system applications.
Researchers from Georgia Tech, the University of Tokyo and Microsoft Research have developed a novel method to rapidly and cheaply make electrical circuits by printing them with commodity inkjet printers and off-the-shelf materials. For about $300 in equipment costs, anyone can produce working electrical circuits in the 60 seconds it takes to print them.
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a leader in dispensing and jetting technologies, will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms for a wide variety of precision dispensing applications in microelectronics and semiconductor manufacturing and MEMS and LED assembly.
Power management company Eaton today announced the launch of AEGIS™ Series surge and line protection solutions. The series combines superior surge protection and filtering capacitors designed to help original equipment manufacturers (OEMs) reduce downtime and maintenance costs.
Current chip technology used for purchasing items via credit and debit cards in shops was developed in the mid-1990s. EMVCo, the standard body which manages, maintains and advances EMV Specifications, is in the process of designing the next generation payment technology to meet long-term industry requirements.
Imec, a leading nanoelectronics research center, announced today that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers, through a unique silicon fin replacement process.
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