TowerJazz, the global specialty foundry leader, has announced the Mentor®’s Calibre® PERC™ rule decks are now available for TowerJazz customers to perform circuit reliability verification for its latest 0.18 micron products, including highly customized electrostatic discharge (ESD) and power management circuit checks.
Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today expands its Visconti™ series of image recognition processors for the automotive market with the launch of Visconti™3, part number TMPV7528XBG.
The Québec Electronic Products Recycling Association (EPRA-Québec) is pleased to announce that, starting today, retailers Best Buy and Future Shop have joined Quebec's program for the responsible recovery and reclamation of electronic products.
Miniature wire harness and connectors are increasingly being adapted to the more rugged environment of portable medical and military electronics. Reduced space for interconnections, demand for smaller more flexible wiring and tight area circuit board contact systems have pushed the limits of conventional connector systems.
Millions of tons of food are thrown away each year because the 'best before' date has passed. But this date is always a cautious estimate, which means a lot of still-edible food is thrown away.
Brooks Instrument, a world-leading provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.
Northwestern University’s Yonggang Huang and the University of Illinois’ John A. Rogers are the first to demonstrate a stretchable lithium-ion battery -- a flexible device capable of powering their innovative stretchable electronics.
Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it has been elected to lead the Electronic Component Sintered Interconnections (ELCOSINT) industry team in developing novel polymeric, sintered interconnection materials to replace high lead (Pb) content materials and further increase the operating temperature of electronic assemblies.
GeneSiC Semiconductor, a pioneer and global supplier of a broad range of Silicon Carbide (SiC) power semiconductors today announces the immediate availability of a family of 1700V and 1200 V SiC Junction Transistors.
Research and Markets has announced the addition of Wintergreen Research, Inc's new report "Touch Panel Transparent Conductive Film: Market Shares, Strategies, and Forecasts, Worldwide, Nanotechnology, 2013 to 2019" to their offering.
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