element14 has declared that the range of Fairchild Semiconductor logic ICs and metal–oxide–semiconductor field-effect transistors (MOSFETs) has been increased by 20% and 50%, respectively. The company’s overall range of Fairchild products has been increased to more than 2,500, through this expansion.
MARTIN has announced that its solder bumping or mini-oven reball unit will be exhibited at the SMTA Upper Midwest Expo & Tech Forum, which will be held on 7 June, 2012.
SEHO Systems, manufacturer of customer-specific solutions and automated soldering systems, has reported that the PowerWave N2 will be highlighted at the SMTA Upper Midwest Expo & Tech Forum.
FCT Assembly, a manufacturer of precision cut components, superior quality stencils, leaded and lead-free solder products, has reported that the company will participate in the SMTA Upper Midwest Expo & Tech Forum, which will be held on June 7, 2012 at the Hilton Minneapolis/Bloomington Hotel in Minnesota.
Nihon Superior, a producer and distributor of metal jointing materials for electronics applications, will exhibit its new soldering products at the JISSO PROTEC 2012 exposition, which will be held in Tokyo, Japan from June 13 to 15.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will exhibit at the upcoming Society for Information Display (SID), in Boston.
Corning Gorilla Glass 2, a novel cover glass offered by Corning, is selected for application in the innovative Samsung GALAXY S III smartphone. The advanced glass was introduced at the Consumer Electronics Show, which took place in Las Vegas in early 2012.
NEPCON South China is the most significant trade event in the country and will be held from 28 to 30 August, 2012 at Shenzhen Convention & Exhibition Center. ATE China 2012 will be collocated and run concurrently with this show. South China is the largest export center and manufacturing hub of the electronics information industry. Experts have calculated that yearly requirement for the assembly of electronic equipment along the Pearl River Delta and in Shenzhen are more than RMB 300 billion.
CyberOptics, a provider of process yield and throughput improvement solutions for the worldwide electronics assembly and semiconductor equipment markets, announced that it will exhibit the QX100 automated optical inspection (AOI) tabletop system powered by AI2 (Autonomous Image Interpretation), an advanced image analysis software, at the JISSO PROTEC 2012 expo. The event will be held from June 13 to 15, 2012 in Tokyo, Japan.
A research team at Penn State has developed a two-dimensional (2D) bilayer material by integrating one-to-two-atom-thick graphene layer with a hexagonal boron nitride (hBN) layer having a thickness of few to several hundred atoms for fabricating wafer-scale transistors with improved performance.
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