Applied Materials has announced that the company has introduced a new Applied Varian VIISta Trident system, which is an advanced single-wafer and high-current ion implant system in the semiconductor industry.
Nordson MARCH, a worldwide leader in plasma cleaning and treatment equipment, and plasma applications technology, has announced that it will showcase equipment at three trade shows during this month.
Engineered Material Systems (EMS), a global provider of electronic materials for use in circuit assembly applications, has declared that 535-10M-1 UV Cured Adhesive has been added to the company’s broad product line of electronic materials and has been formulated in such a way that it can be used in optoelectronic and circuit assembly, and disk drive camera module applications.
element14 has declared that the range of Fairchild Semiconductor logic ICs and metal–oxide–semiconductor field-effect transistors (MOSFETs) has been increased by 20% and 50%, respectively. The company’s overall range of Fairchild products has been increased to more than 2,500, through this expansion.
MARTIN has announced that its solder bumping or mini-oven reball unit will be exhibited at the SMTA Upper Midwest Expo & Tech Forum, which will be held on 7 June, 2012.
SEHO Systems, manufacturer of customer-specific solutions and automated soldering systems, has reported that the PowerWave N2 will be highlighted at the SMTA Upper Midwest Expo & Tech Forum.
FCT Assembly, a manufacturer of precision cut components, superior quality stencils, leaded and lead-free solder products, has reported that the company will participate in the SMTA Upper Midwest Expo & Tech Forum, which will be held on June 7, 2012 at the Hilton Minneapolis/Bloomington Hotel in Minnesota.
Nihon Superior, a producer and distributor of metal jointing materials for electronics applications, will exhibit its new soldering products at the JISSO PROTEC 2012 exposition, which will be held in Tokyo, Japan from June 13 to 15.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will exhibit at the upcoming Society for Information Display (SID), in Boston.
Corning Gorilla Glass 2, a novel cover glass offered by Corning, is selected for application in the innovative Samsung GALAXY S III smartphone. The advanced glass was introduced at the Consumer Electronics Show, which took place in Las Vegas in early 2012.
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