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Semiconductor Packaging Solutions Provider Breaks Ground for New Factory

STATS ChipPAC, a provider of semiconductor advanced packaging and test solutions, has conducted the groundbreaking ceremony for its new plant to be built close to its existing facility in Yishun, Singapore, to expand its production capabilities for sophisticated wafer level technologies such as through silicon via (TSV), integrated passive devices (IPD), wafer level chip scale packaging (WLCSP) and embedded wafer level ball grid array (eWLB).

6 Jan 2012

Introduction of UBC550L Series by ATC for Optical High-Speed Data Communications

ATC is a pioneer in producing millimeter-wave, microwave, and RF passive components. An ultra-broadband capacitor (UBC) has been developed for optical high-speed data communications signal integrity markets by ATC.

5 Jan 2012

Comprehensive Report Discusses Advanced IC Packaging Materials, Technologies and Markets

Research and Markets has declared that it now offers a new market research report titled, ‘Advanced IC Packaging Technologies, Materials, and Markets, 2011 Edition.’

27 Dec 2011

Scientists Develop Sensor for Alerting Lithium-Ion Battery’s Catastrophic Failure

Scientists have developed a less-expensive sensor, which can alert the imminent appalling failure in the lithium-ion cells used in the electric and hybrid vehicles, at the Applied Physics Laboratory (APL) of Johns Hopkins University in Laurel.

23 Dec 2011

Sematech, Dainippon Screen Partner to Develop Advanced Semiconductor Doping Technology

SEMATECH has inked a partnership deal with Dainippon Screen Mfg. to develop and commercialize sophisticated semiconductor doping technology for the sub-14 nm semiconductor production.

21 Dec 2011

Better Understanding of Electric Friction

Max-Born-Institute researchers have followed electrons in real-time to study the rapid onset of electrical resistance in semiconductors.

20 Dec 2011

ISA Selects Berkeley Design Automation as Winner of Technovation Award

Berkeley Design Automation, a pioneer in nanometer circuit verification, has declared that the India Semiconductor Association (ISA), an organization addressing the Indian electronic system design and manufacturing industry, has chosen Berkeley Design Automation as a recipient of the ISA Technovation Award (December 2011) under the Semiconductor (Intellectual Property) category.

17 Dec 2011

Dual-Lane Metallization Firing System Surpasses Industry Norms for Wafer Breakage

BTU International, a provider of sophisticated thermal processing systems for the electronics and renewable energy markets, has proclaimed that its dual-lane metallization firing system called TRITAN HV90 has surpassed industry norms for wafer breakage.

17 Dec 2011

STMicroelectronics Fabricates Semiconductor Wafer Employing EMWS Technology

STMicroelectronics has declared that it has successfully produced the first-of-its-kind semiconductor wafer, whose dice were completely tested devoid of contact probes.

16 Dec 2011

Vorbeck Materials Raises Fund to Expand Sales of Graphene-Based Conductive Ink

Vorbeck Materials has declared that it has wrapped up a completely subscribed series 3 funding with a total amount of $10 million. The funding was completed on 9 December 2011. Fairbridge Venture Partners and Black Powder are the companies which led the funding that also comprised of 15 more investors.

15 Dec 2011

Editorial Highlights

The Material Breakthroughs Revolutionizing Photovoltaics

Photovoltaic technology is revolutionizing sustainable energy with advancements in perovskite cells and innovative recycling methods for eco-friendly solutions.

Emerging Technologies and Trends in the Aerospace Industry

The global economy depends on the aerospace industry, and the technological advancements the aerospace industry has to offer are immense. This article aims to delve into the fascinating world of aerospace and explore the most promising trends and technologies that the industry is developing. How will they pave the future of air travel, and will they make it safer, more sustainable, and more efficient?

Microporous Polymers and Their Applications

Microporous polymers, with their unique structures and properties, are revolutionizing gas storage, carbon capture, and catalysis in various scientific fields.

Electronics News

Semiconductor Packaging Solutions Provider Breaks Ground for New Factory

Introduction of UBC550L Series by ATC for Optical High-Speed Data Communications

Comprehensive Report Discusses Advanced IC Packaging Materials, Technologies and Markets

Scientists Develop Sensor for Alerting Lithium-Ion Battery’s Catastrophic Failure

Sematech, Dainippon Screen Partner to Develop Advanced Semiconductor Doping Technology

Better Understanding of Electric Friction

ISA Selects Berkeley Design Automation as Winner of Technovation Award

Dual-Lane Metallization Firing System Surpasses Industry Norms for Wafer Breakage

STMicroelectronics Fabricates Semiconductor Wafer Employing EMWS Technology

Vorbeck Materials Raises Fund to Expand Sales of Graphene-Based Conductive Ink

Breaking Boundaries in Ceramic Machining with Internal Threading Innovation

Analytical Techniques Reveal History’s Tracked Changes

Beyond Lithium-Ion: Engineering the Future of Battery Technology

Improve Plastic Pipe Testing Accuracy With ATS Ring Pull Fixtures

HTF Fluid for Extreme Conditions

Maximize Efficiency in Semiconductor QA with the Dimension IconIR300

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How Sigma WinCCS Became the Global Standard for Creep and Stress Rupture Testing

Guide to Metal and Alloy Sorting

Enhancing Environmental Testing Through ETHOS EASY Laboratory Flexibility

Temperature Calibration in UHT Milk Production

Editorial Highlights

The Material Breakthroughs Revolutionizing Photovoltaics

Emerging Technologies and Trends in the Aerospace Industry

Microporous Polymers and Their Applications

Electronics News

Breaking Boundaries in Ceramic Machining with Internal Threading Innovation

Analytical Techniques Reveal History’s Tracked Changes

Beyond Lithium-Ion: Engineering the Future of Battery Technology

1Banana Peels Power New Green Route to High-Performance Lithium-Ion Batteries

2Unlocking Solar Efficiency with a Breakthrough in Passivation

3Processing Lignin Differently Could Dramatically Change its Electrical Properties

4KTU Researchers Develop Sustainable Smart Polymers for Medicine, Electronics, and Optics

5New Insights into Perovskite Solar Cell Failure Pathways

6Martian Homes Will be Made From Soil and Spirulina

Sponsored Content

Editorial Highlights