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Liquid Microcrystals Can be Compressed to Form Multi Layers

Researchers from the Institute of Physical Chemistry of the Polish Academy of Sciences (IPC PAS) have conducted studies to establish methods of forming multi layers of liquid crystals by compressing it from the sides.

18 Nov 2011

STATS ChipPAC Completes Capacity Expansion of Semiconductor Packaging Plant in Taiwan

STATS ChipPAC has declared the completion of the capacity expansion of its 300-mm wafer level chip scale packaging (WLCSP) and wafer bump facility located in Taiwan.

18 Nov 2011

Semiconductor Manufacturers Place Orders for ANTARES Cleaning System

FSI International, a provider of surface conditioning devices for production of microelectronics, has declared that it has received more orders for its ANTARES cryokinetic cleaning system from several semiconductor manufacturers.

16 Nov 2011

Park ElectroChemical Introduces High-Speed Digital Electronic Material Products

Park ElectroChemical has introduced two new digital high-speed electronic material products namely the N4800-20 and N4800-20 SI, which are available in laminate and prepreg forms.

From Park Aerospace Corp. 16 Nov 2011

Researchers Present Novel Findings on Amorphous Silicon Structure

Amorphous silicon is a key constituent in next-generation flat-screen televisions and solar panels. The University of Girona scientists along with assistance from laboratories of the French National Centre for Scientific Research (CNRS) and University of Barcelona, conducted a new study, which has unveiled that the amorphous silicon’s energy in its most stable state is 50% less than the normal value.

11 Nov 2011

Nordson MARCH Announces RollVIA Plasma System

A new RollVIA plasma system has been introduced by Nordson MARCH. This is a self-contained vacuum system, along with roll-to-roll material handling feature meant for the printed circuit board (PCB) manufacturing environments.

10 Nov 2011

Mentor Graphics in Partnership with STMicroelectronics Tapes Out 20 nm Test Chip

Mentor Graphics, in partnership with STMicroelectronics has successfully taped out a 20 nm test chip, representing a key landmark in the advancement of a full Mentor design-to-silicon solution for future-generation production technology.

8 Nov 2011

Inexpensive Newspaper-Style Printing Process for Manufacture of OLEDs

Researchers at the Holst Centre in Eindhoven have portrayed a new method of producing flexible and thin sheets of organic light-emitting diode (OLED). The researchers, Paul Blom and Ton van Mol, detailed an inexpensive, newspaper-style “roll-to-roll” printing process.

4 Nov 2011

Solder Recycling Machine Produces Pure Solder Ingots

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that an independent lab has confirmed that its Solder Paste Recycling (SPR) machine is capable of producing pure solder ingots from solder paste.

30 Oct 2011

Korean Firm Buys ACM Research Shanghai’s Ultra C Single-Wafer Megasonic Cleaning Device

A Korean memory manufacturer has purchased ACM Research Shanghai’s Ultra C 12-inch, single-wafer megasonic cleaning device that uses its space-alternated phase shift (SAPS) technology.

From ACM Research, Inc. 29 Oct 2011

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