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Innovative Plastics Introduces Colorable Thermoplastic Compound for LDS Applications

Innovative Plastics Introduces Colorable Thermoplastic Compound for LDS Applications

Atrenta, Imec to Demonstrate Advanced Design Flow for 3D Stacked ICs at DAC

Atrenta, Imec to Demonstrate Advanced Design Flow for 3D Stacked ICs at DAC

Imec Expands Collaboration with Qualcomm on 3D Technology

Imec Expands Collaboration with Qualcomm on 3D Technology

PI Ceramic Provides Lead-Free Piezoelectric Material for Ultrasonic Transducers

PI Ceramic Provides Lead-Free Piezoelectric Material for Ultrasonic Transducers

New Line of Lithium-Ion Batteries from Leyden Energy

New Line of Lithium-Ion Batteries from Leyden Energy

Nanocyl Exhibits Carbon Nanotube Technologies at Chinaplas 2011

Nanocyl Exhibits Carbon Nanotube Technologies at Chinaplas 2011

Researchers Develop Dielectric Elastomeric Sensors

Researchers Develop Dielectric Elastomeric Sensors

Liquid-Based Coating Solution for Hand Held Devices

Liquid-Based Coating Solution for Hand Held Devices

Rogers Expands PORON ThinStik Series of Self-Adhesive Foams

Rogers Expands PORON ThinStik Series of Self-Adhesive Foams

IXYS Partners with GMCH for Semiconductor Wafer Fabrication

IXYS Partners with GMCH for Semiconductor Wafer Fabrication

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