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GE Scientists Develop Novel Thermal Material System for High-Speed Electronics

Scientists working at GE’s Global Research Center of GE declared that they have developed a prototype substrate that can prevent heat build-up in electronic devices such as laptop and can cool them down better than copper.

17 Mar 2011

MIT Researchers Examine Behavior of Self-Oscillating Gels

A doctoral candidate in the Krystyn J. Van Vliet’s lab, Irene Chou Chen investigates how the changes in shape and size of self-oscillating gels have influence on the materials’ behavior.

16 Mar 2011

IMT Introduces Hermetic Au-Au Thermo Compression Bonding for Wafer Level Packaging

A specialist in the development and execution of wafer level packaging, Innovative Micro Technology (IMT) has launched its hermetic Au-Au thermo compression bonding, which is marked as the industry’s highly economical hermetic wafer level package (WLP) bond.

14 Mar 2011

OSRAM Opto Semiconductors Expands Chip Production Capacity

Semiconductor technology-based solutions provider for visualization, sensor and lighting applications, OSRAM Opto Semiconductors has proclaimed that it will convert and expand its two chip production plants into 6" wafer production plants.

From Osram Opto Semiconductors GmbH 14 Mar 2011

Mounting Graphene on Boron Nitride Improves Electronic Properties

Graphene – a sheet of carbon atoms linked in a hexagonal, chicken wire structure – holds great promise for microelectronics.

5 Mar 2011

Duke Engineers Study Break Down of Soft Polymer Under Exposure to Electrical Current

A Duke University team has seen for the first time how soft polymers, such as wire insulation, can break down under exposure to electrical current.

5 Mar 2011

Palomar Technologies to Present at IMAPS Device Packaging Conference

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the IMAPS Device Packaging conference on March 8-9 in Scottsdale, AZ.

5 Mar 2011

Amprius Announces Commercialization of Next-Generation Lithium Ion Batteries

Amprius has raised $25 million to commercialize next generation lithium ion batteries leveraging Amprius’ proprietary silicon-based electrode technology.

4 Mar 2011

Thin Film Electronics Wins 2010 Frost + Sullivan Global New Product Innovation Award

The 2010 Frost & Sullivan Global New Product Innovation Award in Printed Electronic Memories is presented to Thin Film Electronics ASA ('Thinfilm'). The company is commended for its unique non-volatile, printable, polymer-based memory products.

3 Mar 2011

Analytik Jena Releases New Solid Atomic Absorption Spectrophotometry Brochure

A new 16 page brochure highlighting the benefits of direct solid atomic absorption spectrophotometry (AAS) is now available from Analytik Jena UK.

From Analytik Jena US 2 Mar 2011

Editorial Highlights

The Material Breakthroughs Revolutionizing Photovoltaics

Photovoltaic technology is revolutionizing sustainable energy with advancements in perovskite cells and innovative recycling methods for eco-friendly solutions.

Emerging Technologies and Trends in the Aerospace Industry

The global economy depends on the aerospace industry, and the technological advancements the aerospace industry has to offer are immense. This article aims to delve into the fascinating world of aerospace and explore the most promising trends and technologies that the industry is developing. How will they pave the future of air travel, and will they make it safer, more sustainable, and more efficient?

Microporous Polymers and Their Applications

Microporous polymers, with their unique structures and properties, are revolutionizing gas storage, carbon capture, and catalysis in various scientific fields.

Electronics News

GE Scientists Develop Novel Thermal Material System for High-Speed Electronics

MIT Researchers Examine Behavior of Self-Oscillating Gels

IMT Introduces Hermetic Au-Au Thermo Compression Bonding for Wafer Level Packaging

OSRAM Opto Semiconductors Expands Chip Production Capacity

Mounting Graphene on Boron Nitride Improves Electronic Properties

Duke Engineers Study Break Down of Soft Polymer Under Exposure to Electrical Current

Palomar Technologies to Present at IMAPS Device Packaging Conference

Amprius Announces Commercialization of Next-Generation Lithium Ion Batteries

Thin Film Electronics Wins 2010 Frost + Sullivan Global New Product Innovation Award

Analytik Jena Releases New Solid Atomic Absorption Spectrophotometry Brochure

Breaking Boundaries in Ceramic Machining with Internal Threading Innovation

Analytical Techniques Reveal History’s Tracked Changes

Beyond Lithium-Ion: Engineering the Future of Battery Technology

Improve Plastic Pipe Testing Accuracy With ATS Ring Pull Fixtures

HTF Fluid for Extreme Conditions

Maximize Efficiency in Semiconductor QA with the Dimension IconIR300

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How Sigma WinCCS Became the Global Standard for Creep and Stress Rupture Testing

Guide to Metal and Alloy Sorting

Enhancing Environmental Testing Through ETHOS EASY Laboratory Flexibility

Temperature Calibration in UHT Milk Production

Editorial Highlights

The Material Breakthroughs Revolutionizing Photovoltaics

Emerging Technologies and Trends in the Aerospace Industry

Microporous Polymers and Their Applications

Electronics News

Breaking Boundaries in Ceramic Machining with Internal Threading Innovation

Analytical Techniques Reveal History’s Tracked Changes

Beyond Lithium-Ion: Engineering the Future of Battery Technology

1Banana Peels Power New Green Route to High-Performance Lithium-Ion Batteries

2Unlocking Solar Efficiency with a Breakthrough in Passivation

3Processing Lignin Differently Could Dramatically Change its Electrical Properties

4KTU Researchers Develop Sustainable Smart Polymers for Medicine, Electronics, and Optics

5New Insights into Perovskite Solar Cell Failure Pathways

6Martian Homes Will be Made From Soil and Spirulina

Sponsored Content

Editorial Highlights