Tomorrow's television and computer screens could be brighter, clearer and more energy-efficient as a result of a process developed by a team of researchers from Canada and the Department of Energy's Oak Ridge Nation...
Research and Markets (http://www.researchandmarkets.com/research/2c502d/silicon_carbide_v) has announced the addition of John Wiley and Sons Ltd's new book "Silicon Carbide: Volume 1: Growth, Defects, and Novel Appl...
For centuries, "man-made fibers" meant the raw stuff of clothes and ropes; in the information age, it's come to mean the filaments of glass that carry data in communications networks.
Motion Computing® developed the C5 Mobile Clinical Assistant (MCA) to bring accurate patient data input and retrieval to the point of care in a hospital or other clinical setting.
The slate form facto...
NEXX Systems– a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat sputter tool order for an Apollo physical vapor deposition system ...
Integral Technologies, Inc. (OTCBB:ITKG) (“Integral”), today announces (1) the international market deployment of the ElectriPlast™ pellet, a patented method of pelletizing conductive plastics based on its original ...
Mitsubishi Electric Corporation announced today it plans to invest 6.5 billion yen to expand its wafer production capacity for power devices by approximately 2.5 times that of the previous fiscal year.
Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.
"We are very...
Technology leaders in the emerging lead-free bumping market are meeting “green” global policy requirements, such as ROHS, by using NEXX Systems’ Stratus plating tool to produce their system-in-package (SiP) and 3D w...
Electro Scientific Industries, a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry, today unveiled its new 9900 system for ultra-thin wafer dicing.
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