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Specialized Resins Designed for Complex Multi-Part Connectors

Specialized Resins Designed for Complex Multi-Part Connectors

BASF Create Advanced Copper Plating Chemistry for Chip Technologies

BASF Create Advanced Copper Plating Chemistry for Chip Technologies

Materials + Microsystems Centre of Fondazione Bruno Kessler Achieves ISO/IEC 17025  Accreditation

Materials + Microsystems Centre of Fondazione Bruno Kessler Achieves ISO/IEC 17025 Accreditation

Printed Electronics Awards Presented at Conference in Europe

Noliac Actuators Attract A Lot of Interest at SPIE Defense, Security and Sensing 2010 Exhibition

Noliac Actuators Attract A Lot of Interest at SPIE Defense, Security and Sensing 2010 Exhibition

Dow Release Bio-Based Plasticizers for Wire and Cable Makers

Zenergy Power Develops 2G Superconducting Wire Produced by High Speed Ink Jet Printing

Sirris Purchases Aerosol Jet Deposition System

Unidym Transparent Conductive Films Displayed at 75th China Electronics Fair

Nanocyl to Showcase CNT Technologies for Electronics and Automotive Applications at Chinaplas

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