Maskless Lithography, Inc., a Silicon Valley startup led by a group of industry veterans, today came out of stealth mode with a brand new direct-write digital imaging technology that will raise the bar in printed circuit...
Design engineers in the electronics industry who are seeking ways to improve power integrity and reduce electromagnetic interference (EMI) while meeting halogen-free requirements now have a new solution to meet their nee...
Printed circuit board (PCB) and integrated circuit (IC) package design engineers can now download a simulated model of Embedded Capacitance Materials (ECM) from 3M for use in HFSS™ and SIwave™ engineering simulation software.
The World biggest semiconductor foundry from Taiwan has placed a combined order for the Mask Defect Repair System MeRiT® HR 32 and the Aerial Image Measurement System AIMS™ 32-193i from Carl Zeiss to prepare for the production of next generation high-end photomasks.
The Ohio University-led study, published Sunday as an advance online publication in the journal Nature Nanotechnology, provides the first evidence that nanoscale molecular superconducting wires can be fabricated, which could be used for nanoscale electronic devices and energy applications.
Arrhythmic hearts soon may beat in time again, with minimal surgical invasion, thanks to flexible electronics technology developed by a team of University of Illinois researchers, in collaboration with the University of Pennsylvania School of Medicine and Northwestern University. These biocompatible silicon devices could mark the beginning of a new wave of surgical electronics.
American Superconductor Corporation (NASDAQ: AMSC), a global power technologies company, and LS Cable Ltd. (LS Cable), the third largest power cable manufacturer in the world, today announced that they have expanded thei...
In future every home will have one: electronic devices that you can control just by pointing a finger. To turn this vision into reality the 3Plast research consortium is developing special sensors that can be printed onto plastic film and affixed to objects.
Arkema will showcase its specialty resin and organic peroxide ranges for electric and electronic cabling at the Düsseldorf Wire & Tube international tradeshow from April 12 to 16.
The technology group, The Linde Group, and leading Chinese engineering university, Shanghai University, announce today their partnership to explore and develop new advanced packaging solutions for flexible displays to en...
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