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Perovskite Could be the Key for Future Electronics and Nanoelectronics

Dow Corning to Showcase Innovative Pressure Sensitive Silicone Adhesives

Oxford Instruments Plasma Analysis to Host Seminars in 2009

Oxford Instruments Plasma Analysis to Host Seminars in 2009

New Materials Could See Microchips that Process Data Much Faster than Silicon Chips

New Materials Could See Microchips that Process Data Much Faster than Silicon Chips

EPCOS Release New PTC Components with Stainless Steel Packages for Liquid Level Sensing

EPCOS Release New PTC Components with Stainless Steel Packages for Liquid Level Sensing

Outdoor Wire Connnectors that Seal, Strip and are Waterproof

Outdoor Wire Connnectors that Seal, Strip and are Waterproof

3M Enter into Lithium Ion Battery Agreement

Tyco Electronics to Support Robotics Competition

Making Photodetectors Truly Green Devices

Noted MIT Scientist Launches American Chemical Society Meeting

Noted MIT Scientist Launches American Chemical Society Meeting

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