Indium Corporation, a premium materials manufacturer and supplier of electronics assembly materials, and Mycronic, a global leader in dispensing and jet printing equipment, have formed a strategic partnership for the development of no-clean and water soluble solder pastes for jetting applications.
Critical Manufacturing, a worldwide provider of MES for Industry 4.0, has partnered with Cogiscan (Bromont, Canada), the leading connectivity solutions provider for the electronics manufacturing industry in order to deliver advanced Smart Factory solutions for electronics manufacturers.
Thorlabs announced today that it has released next-generation versions of its MEMS-VCSEL Swept-Wavelength Laser Sources. The new SL10 series, centered at 1060 nm, complements the already well-established SL13 series at 1300 nm and is available with four different sweep rates ranging from 60 kHz to 400 kHz.
Data I/O Corporation, the leading global provider of advanced data and security deployment solutions for flash, flash-memory based intelligent devices and microcontrollers today announced NexTeach™ Pro and handler performance enhancements to the PSV7000 that reduce job setup time by up to 4x and increase production throughput up to 24%, respectively.
productronica 2019 will see the launch of the xReflow™ Heated Stage. Visit Hall A2 Booth 534 to learn more about this new exciting development in real-time observation of void formation using X-ray.
ZF Electronic Systems is pleased to introduce STEUTE’s Series ZS Pull-Wire Switches ideal for on/off control switching or opening/closing electrically-operated doors or gates.
Nordson DAGE, a division of the Nordson Corporation is proud to announce the launch of Assure™, the most intelligent, simplest, fastest and most reliable way to implement live component inventory management into your organization.
Thorlabs has announced the recent release of a new series of USB-powered pointer lasers for alignment and daily lab use.
Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous integration, which packs more dies or components into smaller footprints, requires multiple technological advancements in various aspects of advanced packaging.
Imagine a device that can sit outside under blazing sunlight on a clear day, and without using any power cool things down by more than 23 degrees Fahrenheit (13 degrees Celsius). It almost sounds like magic, but a new system designed by researchers at MIT and in Chile can do exactly that.
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